Process 2000


Process

CONTECH’s Process 2000 is a proprietary die casting process developed to meet the increasing needs of our customers to provide a product with mechanical properties exceeding those that can be obtained by traditional High Pressure Die Casting (HDPC).

Process 2000  combines the unique advantages of HPDC (near net shape, fast cycle times, variety of alloys) with the unique advantages of Low Pressure Casting (minimal porosity, solution heat treatment, thick wall sections) into a process that design engineers can exploit in their efforts to lower costs and improve reliability.  In addition, the technical advantages of CONTECH’s Enhanced HPDC process are also present in 2000 – namely complete computer-controlled automation and localized squeeze pin technology.


Targeted Overall Wall Thickness:  > 10mm

Product Focus
•    Axle Components
•    Engine Components
•    Steering Components
•    Suspension Components

Alloys
•    A356, 390, ADC12, 380, 383

Physical Properties
•    Tight Dimensional Control
•    Complex Tooling/Geometries
•    Minimal Porosity
•    Pressure Tightness
•    Improved Tensile Properties, Including Ductility
•    Refined Microstructure (Rapid Solidification)

Benefits
•    Alloy Flexibility
•    Heat Treat Options (T4, T5, T6)
•    Ease of Machining

Design Advantages
•    Proven Process/Product Development Success
•    More “As Cast” Features than Permanent Mold or Low Pressure
•    Minimal Machining Stock

Overall Advantages

All of these benefits bring the advantages of lower cost, improved mechanical properties, and improved performance.  Cost reductions are achieved by increasing heat treatment options and greater ease of machining.  Alloy flexibility contributes to improved mechanical properties.  Also, design advantages lead to overall performance improvement.

 

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Process Attributes
• Vertical shot and horizontal die clamping
• Tilt docking injection unit
• High pressure delivery system
• Multiple cavities
• Larger runner and gates for directional solidification
• Minimal air entrapment and reduced shrink porosity
• Dimensional control similar to that of HPDC
• Preferred wall thickness >2.5 mm
• Heat treatable (T4, T5, T6 and T7)
• Weldable (MIG, TIG)
• Refined microstructure – rounded eutectic silicon and smaller DAS
• Improved tensile properties, particularly ductility
• Alloy flexibility
• Use of ‘localized’ squeeze, if needed
• Metal cleanliness >90% density index